The serial communication scheme of single-chip design has fewer pins, smaller package size, and integrates storage array and controller on the same chip, with internal ECC module, which not only meets the data transmission efficiency but also saves space and improves stability. The product now has mature process technologies for 38nm and 2xnm, and the process technology has been advanced to 1xnm. The product can provide two voltages of 1.8V/3.3V, and has multiple packaging forms of WSON, BGA and LGA. It can not only meet the requirements of conventional application scenarios, but also maintain low power consumption in the increasingly popular battery driven mobile Internet and Internet of Things devices, effectively extend the standby time of the device, and more flexibly apply to different application scenarios.