About us
Shenzhen Qianhai Weitu Zhongcheng Technology Co., Ltd
Based on the core, intelligently connecting the future
Shenzhen Qianhai Weitu Zhongcheng Technology Co., Ltd. was established in 2014, with its office located at Ziguang Information Port in the North District of Nanshan District, Shenzhen. It focuses on the automotive electronics and semiconductor industry, with a business focus on the five major domains of automobiles: cockpit domain, body domain, intelligent driving domain, chassis domain, and power domain. At the same time, it also takes into account the sub modules of automotive related functions such as central control platform, entertainment navigation system, body electronics, motor drive, automotive lighting, interior ambient lighting, and wireless charging, promoting overall solutions for automotive electronic components.
At present, the main product lines we represent include: Ruifa Ke LVDS SerDes, French Thales e-sim, Kaiyang SOC, Xinwang Micro MCU, Cenke Inductance, Korean Samsung Memory, Dongxin Memory, and Anshi IGBT. We have accumulated rich industry experience in the automotive electronics field and have been providing high-quality services to industry customers for many years.
12 Year
180 item
24 h
260 +
Core technology
Core technology
Professional Team
The main product lines we represent include: Ruifa Ke LVDS SerDes, France's Thales e-sim, Kaiyang SOC, Xinwang Micro MCU, Cenke Inductance, South Korea's Samsung Memory, Dongxin Memory, and Anshi IGBT. We have accumulated rich industry experience in the automotive electronics field and have been providing high-quality services to industry customers for many years.
Design
Technology
Package
Chip packaging not only protects the chip, but also enables electrical connections and heat dissipation. From traditional wire bonding
Packaging technology continues to evolve, including advanced flip chip, wafer level packaging, 2.5D/3D packaging, and more.
Manufacturing Technology
HSMT standard chip, speed 2-12.8Gbps, controllable domestic IP, supports high pixel cameras and 4K screens,
Vehicle grade resistance to harsh environments, coupled with a platform to achieve seamless switching between 450+global operators
Manufacturing Technology
Using automotive grade materials that are resistant to harsh environments, they can withstand high temperatures, pressures, humidity, and vibrations,
Paired with seamless switching technology from over 450 global operators, the combination of material stability and connection reliability, ，
Meet the networking needs throughout the entire lifecycle of vehicles and comply with GSMA standard compliance requirements.
高效能源管理系统
Efficient energy management system
智能驾驶辅助功能
Intelligent driver assistance system
轻量化车身设计
Lightweight body design
About us
Shenzhen Qianhai Weitu Zhongcheng Technology Co., Ltd
Based on the core, intelligently connecting the future
Shenzhen Qianhai Weitu Zhongcheng Technology Co., Ltd. was established in 2014, with its office located at Ziguang Information Port in the North District of Nanshan District, Shenzhen. It focuses on the automotive electronics and semiconductor industry, with a business focus on the five major domains of automobiles: cockpit domain, body domain, intelligent driving domain, chassis domain, and power domain. At the same time, it also takes into account the sub modules of automotive related functions such as central control platform, entertainment navigation system, body electronics, motor drive, automotive lighting, interior ambient lighting, and wireless charging, promoting overall solutions for automotive electronic components.
At present, the main product lines we represent include: Ruifa Ke LVDS SerDes, French Thales e-sim, Kaiyang SOC, Xinwang Micro MCU, Cenke Inductance, Korean Samsung Memory, Dongxin Memory, and Anshi IGBT. We have accumulated rich industry experience in the automotive electronics field and have been providing high-quality services to industry customers for many years.
12 year
Deeply cultivate industries
180 item
Core Technology
24 h
Rapid response
260 +
Top Talent
Core technology
Core Technology
Design Technique
Integrated circuit design is the foundation of chip development, covering system architecture design, logic design, circuit design, and more. Using electronic design automation (EDA) tools to transform complex functional requirements into chip layouts.
Package
Chip packaging not only protects the chip, but also enables electrical connections and heat dissipation. From traditional wire bonding packaging to advanced flip chip, wafer level packaging, 2.5D/3D packaging, packaging technology continues to evolve.
Manufacturing Technology
The process technology is the core of chip manufacturing, which constructs nanoscale transistors and circuits on silicon wafers through processes such as photolithography, etching, and deposition.
Materials Technology
Silicon is the main material for chip manufacturing, but in recent years, new materials have emerged to meet higher performance demands, such as wide bandgap semiconductor materials such as silicon carbide (SiC) and gallium nitride (GaN).
Email:
sales@voto.cc
Address:
701, Building D, Ziguang Information Harbor, North District, High tech Park, Nanshan District, Shenzhen
Email: sales@voto.cc
Headquarters Address: 7th Floor, Building D, Ziguang Information Harbor, North District, High tech Park, Nanshan District, Shenzhen
anyanqun@voto.cc
sales@voto.cc
中文
English
